MAX4717EUB vs NLAS4717 feature comparison

MAX4717EUB Maxim Integrated Products

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NLAS4717 onsemi

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC ON SEMICONDUCTOR
Part Package Code TSSOP BCC
Package Description TSSOP, TSSOP10,.19,20 2 X 1.50 MM, MICROBUMP-10
Pin Count 10 10
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SPDT
JESD-30 Code S-PDSO-G10 R-PBGA-B10
JESD-609 Code e0 e0
Length 3 mm 1.965 mm
Moisture Sensitivity Level 1
Number of Channels 1 1
Number of Functions 2 1
Number of Terminals 10 10
Off-state Isolation-Nom 55 dB 55 dB
On-state Resistance Match-Nom 0.1 Ω 0.18 Ω
On-state Resistance-Max (Ron) 4.5 Ω 2 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VFBGA
Package Equivalence Code TSSOP10,.19,20 BGA10,3X4,20
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.65 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 2.5 V
Surface Mount YES YES
Switch-off Time-Max 40 ns 70 ns
Switch-on Time-Max 80 ns 70 ns
Switching BREAK-BEFORE-MAKE
Technology BICMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL BOTTOM
Width 3 mm 1.465 mm
Base Number Matches 7 8
Manufacturer Package Code MICROBUMP
Samacsys Manufacturer onsemi

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