MAX4717EBC+T
vs
MAX4717EUB/GG8
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
BGA
|
|
| Package Description |
VFBGA, BGA12,3X4,20
|
,
|
| Pin Count |
12
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-XBGA-B12
|
|
| JESD-609 Code |
e1
|
|
| Length |
2.02 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
12
|
|
| Off-state Isolation-Nom |
55 dB
|
|
| On-state Resistance Match-Nom |
0.1 Ω
|
|
| On-state Resistance-Max (Ron) |
4.5 Ω
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA12,3X4,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.67 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Switch-off Time-Max |
40 ns
|
|
| Switch-on Time-Max |
80 ns
|
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.54 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MAX4717EBC+T with alternatives
Compare MAX4717EUB/GG8 with alternatives