MAX4699ETE+T
vs
MAX4699ETE+
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN, LCC16,.16SQ,25
|
4 X 4 MM, ROHS COMPLIANT, TQFN-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
DPDT
|
DPDT
|
JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Off-state Isolation-Nom |
76 dB
|
76 dB
|
On-state Resistance Match-Nom |
2 Ω
|
2 Ω
|
On-state Resistance-Max (Ron) |
75 Ω
|
75 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.16SQ,25
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
20 ns
|
25 ns
|
Switch-on Time-Max |
35 ns
|
45 ns
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MAX4699ETE+T with alternatives
Compare MAX4699ETE+ with alternatives