MAX4691EGE+
vs
MAX4691EBE+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
16-LFCSP-4X4X0.85
|
BGA
|
| Package Description |
4 X 4 MM, ROHS COMPLIANT, QFN-16
|
VFBGA, BGA16,4X4,20
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
16-LFCSP-4X4X0.85
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2001-01-03
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
S-XQCC-N16
|
S-XBGA-B16
|
| JESD-609 Code |
e3
|
e1
|
| Length |
4 mm
|
2.02 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage-Max (Vsup) |
-5.5 V
|
-5.5 V
|
| Neg Supply Voltage-Min (Vsup) |
-2 V
|
-4.5 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
82 dB
|
82 dB
|
| On-state Resistance Match-Nom |
2 Ω
|
2 Ω
|
| On-state Resistance-Max (Ron) |
25 Ω
|
25 Ω
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC16,.16SQ,25
|
BGA16,4X4,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
0.67 mm
|
| Signal Current-Max |
0.02 A
|
0.02 A
|
| Supply Current-Max (Isup) |
0.001 mA
|
0.001 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
60 ns
|
50 ns
|
| Switch-on Time-Max |
90 ns
|
80 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
2.02 mm
|
| Base Number Matches |
2
|
4
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX4691EGE+ with alternatives
Compare MAX4691EBE+ with alternatives