MAX4688EBT-T
vs
MAX4688EBT+T
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
0.5 MM PITCH, MICRO, CSP-6
|
0.5 MM PITCH, MICRO, CSP-6
|
Pin Count |
6
|
6
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-PBGA-B6
|
R-PBGA-B6
|
JESD-609 Code |
e0
|
e1
|
Length |
1.98 mm
|
1.98 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Off-state Isolation-Nom |
90 dB
|
90 dB
|
On-state Resistance Match-Nom |
0.3 Ω
|
0.3 Ω
|
On-state Resistance-Max (Ron) |
2.5 Ω
|
2.5 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA6,2X3,20
|
BGA6,2X3,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.67 mm
|
0.67 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
12 ns
|
12 ns
|
Switch-on Time-Max |
30 ns
|
30 ns
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
1.75 mm
|
1.75 mm
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
EAR99
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX4688EBT-T with alternatives
Compare MAX4688EBT+T with alternatives