MAX44269EWL+T
vs
MCP6567-E/SL
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
SOIC
Package Description
1.30 X 1.30 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLP-9
SOP,
Pin Count
9
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Input Offset Voltage-Max
10000 µV
10000 µV
JESD-30 Code
S-PBGA-B9
R-PDSO-G14
JESD-609 Code
e2
Length
1.26 mm
8.65 mm
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Terminals
9
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Type
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
SOP
Package Equivalence Code
BGA9,3X3,16
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Response Time-Nom
39000 ns
56 ns
Seated Height-Max
0.69 mm
1.75 mm
Supply Current-Max
0.002 mA
Supply Voltage Limit-Max
6 V
6.5 V
Supply Voltage-Nom (Vsup)
5 V
1.8 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN SILVER COPPER NICKEL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.4 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.26 mm
3.9 mm
Base Number Matches
1
1
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