MAX4411EBE+
vs
MAX9723DEBE+T
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
FBGA, BGA14,4X4,20
|
LEAD FREE, PLASTIC, UCSP-16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| JESD-30 Code |
S-PBGA-B14
|
S-PBGA-B16
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
BGA
|
| Package Equivalence Code |
BGA14,4X4,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
8.4 mA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
16
|
| Factory Lead Time |
|
4 Weeks
|
| Consumer IC Type |
|
CLASS AB AUDIO AMPLIFIER
|
| Number of Channels |
|
1
|
| Number of Functions |
|
1
|
|
|
|
Compare MAX4411EBE+ with alternatives
Compare MAX9723DEBE+T with alternatives