MAX4372HEBT+TG45
vs
MAX4372TEUK+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
VFBGA,
|
LSSOP, TSOP5/6,.11,37
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.33.00.01
|
| Adjustable Threshold |
NO
|
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
|
| JESD-30 Code |
R-PBGA-B6
|
|
| JESD-609 Code |
e1
|
|
| Length |
1.52 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
6
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VFBGA
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.67 mm
|
|
| Supply Voltage-Max (Vsup) |
28 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
12 V
|
|
| Surface Mount |
YES
|
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1 mm
|
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
5
|
|
|
|
Compare MAX4372HEBT+TG45 with alternatives
Compare MAX4372TEUK+ with alternatives