MAX4372HEBT+TG45
vs
MAX4372HEUK+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
Package Description |
VFBGA,
|
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
R-PBGA-B6
|
R-PDSO-G5
|
JESD-609 Code |
e1
|
e3
|
Length |
1.52 mm
|
2.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
5
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
LSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.67 mm
|
1.45 mm
|
Supply Voltage-Max (Vsup) |
28 V
|
28 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Matte Tin (Sn)
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.95 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1 mm
|
1.625 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
5-SOT_23-N/A
|
Pin Count |
|
5
|
Manufacturer Package Code |
|
5-SOT_23-N/A
|
Date Of Intro |
|
1999-11-11
|
Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX4372HEBT+TG45 with alternatives
Compare MAX4372HEUK+ with alternatives