MAX4372FESA
vs
MAX4372TEBT+TG45
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.150 INCH, MS-012AA, SOIC-8
|
VFBGA,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.39.00.01
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PDSO-G8
|
R-PBGA-B6
|
| JESD-609 Code |
e0
|
e1
|
| Length |
4.9 mm
|
1.52 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
VFBGA
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
0.67 mm
|
| Supply Current-Max (Isup) |
0.06 mA
|
|
| Supply Voltage-Max (Vsup) |
28 V
|
28 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
| Width |
3.9 mm
|
1 mm
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare MAX4372FESA with alternatives
Compare MAX4372TEBT+TG45 with alternatives