MAX4274BHEUA+
vs
MAX4274BHEUA-T
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
TSSOP,
|
MO-187, UMAX-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.01 µA
|
0.01 µA
|
| Input Offset Voltage-Max |
2000 µV
|
2500 µV
|
| JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
3 mm
|
| Micropower |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HTSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
245
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Slew Rate-Nom |
0.7 V/us
|
0.7 V/us
|
| Supply Current-Max |
1.02 mA
|
1.02 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
3
|
1
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Technology |
|
BIPOLAR
|
| Unity Gain BW-Nom |
|
390
|
|
|
|
Compare MAX4274BHEUA+ with alternatives
Compare MAX4274BHEUA-T with alternatives