MAX4066AESD+
vs
CD54HC4066F3A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
0.150 INCH, SOP-14
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDSO-G14
R-GDIP-T14
JESD-609 Code
e3
e0
Length
8.65 mm
Moisture Sensitivity Level
1
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
14
14
On-state Resistance Match-Nom
0.3 Ω
On-state Resistance-Max (Ron)
75 Ω
142 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
6 V
Surface Mount
YES
NO
Switch-off Time-Max
75 ns
Switch-on Time-Max
125 ns
20 ns
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
4
1
Normal Position
NO
Output
SEPARATE OUTPUT
Package Equivalence Code
DIP14,.3
Supply Current-Max (Isup)
0.16 mA
Switching
MAKE-BEFORE-BREAK
Compare MAX4066AESD+ with alternatives
Compare CD54HC4066F3A with alternatives