MAX4053CEE+
vs
CD54HCT4053F3A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
0.150 INCH, 0.025 INCH PITCH, MO137AB, QSOP-16
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
JESD-609 Code
e3
e0
Length
4.9 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Max (Vsup)
-8 V
Neg Supply Voltage-Min (Vsup)
-2.7 V
Neg Supply Voltage-Nom (Vsup)
-5 V
Number of Channels
1
1
Number of Functions
3
3
Number of Terminals
16
16
Off-state Isolation-Nom
90 dB
On-state Resistance Match-Nom
12 Ω
On-state Resistance-Max (Ron)
100 Ω
270 Ω
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SSOP
DIP
Package Equivalence Code
SSOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
8 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Switch-off Time-Max
150 ns
Switch-on Time-Max
175 ns
48 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.635 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
4
2
Signal Current-Max
0.025 A
Supply Current-Max (Isup)
0.16 mA
Compare MAX4053CEE+ with alternatives
Compare CD54HCT4053F3A with alternatives