MAX40003ANS12+T vs MAX9062EBS+TG45 feature comparison

MAX40003ANS12+T Analog Devices Inc

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MAX9062EBS+TG45 Analog Devices Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code 4-WLCSP-N/A 4-WLCSP-N/A
Pin Count 4 4
Manufacturer Package Code 4-WLCSP-N/A 4-WLCSP-N/A
Reach Compliance Code compliant compliant
Date Of Intro 2017-04-07 2008-05-07
Samacsys Manufacturer Analog Devices Analog Devices
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.09 µA 0.015 µA
Bias Current-Max (IIB) @25C 0.03 µA
Input Offset Voltage-Max 32000 µV 9000 µV
JESD-30 Code S-XBGA-B4 S-PBGA-B4
Length 0.728 mm 1 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 4 4
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Type OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA4,2X2,14 BGA4,2X2,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Response Time-Nom 25000 ns 15000 ns
Seated Height-Max 0.5 mm 0.67 mm
Supply Current-Max 0.0013 mA 0.0011 mA
Supply Voltage Limit-Max 6 V 6 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Terminal Finish Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal Form BALL BALL
Terminal Pitch 0.35 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 0.728 mm 1 mm
Base Number Matches 1 1
Package Description 1 X 1 MM, 0.60 MM HEIGHT, ROHS COMPLIANT, UCSP-4
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL

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