MAX385CSE+
vs
DG442AK/883
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.150 INCH, SO-16
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
DPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
| JESD-609 Code |
e3
|
|
| Length |
9.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-15 V
|
| Normal Position |
NO
|
|
| Number of Channels |
2
|
1
|
| Number of Functions |
2
|
4
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
72 dB
|
60 dB
|
| On-state Resistance Match-Nom |
0.5 Ω
|
|
| On-state Resistance-Max (Ron) |
35 Ω
|
85 Ω
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Current-Max (Isup) |
0.001 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
100 ns
|
210 ns
|
| Switch-on Time-Max |
175 ns
|
315 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
4
|
2
|
|
|
|
Compare MAX385CSE+ with alternatives
Compare DG442AK/883 with alternatives