MAX3747BEUB
vs
SY88347DLEY
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
Package Description
SON,
LEAD FREE, EXPOSED PAD, MSOP-10
Pin Count
10
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PDSO-N10
S-PDSO-G10
JESD-609 Code
e0
e3
Length
3 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
10
10
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SON
HTSSOP
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.1 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BIPOLAR
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
3 mm
3 mm
Base Number Matches
3
3
Compare MAX3747BEUB with alternatives
Compare SY88347DLEY with alternatives