MAX3665EUA+
vs
MAX3665E/D
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Not Recommended
Transferred
Part Package Code
8-MINI_SO-N/A
DIE
Pin Count
8
7
Manufacturer Package Code
8-MINI_SO-N/A
Date Of Intro
2000-02-09
Samacsys Manufacturer
Analog Devices
JESD-30 Code
S-PDSO-G8
R-XUUC-N7
JESD-609 Code
e3
e0
Length
3 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
7
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
3 mm
Base Number Matches
2
2
Pbfree Code
No
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
Package Description
DIE,
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.33.00.01
Compare MAX3665EUA+ with alternatives
Compare MAX3665E/D with alternatives