MAX3485ECPA+
vs
ISL83485IBZ
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DIP
|
SOICN
|
| Package Description |
PLASTIC, DIP-8
|
SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
1
|
1
|
| Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
EIA-422; EIA-485
|
EIA-485; EIA-422
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
9.375 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Receive Delay-Max |
|
90 ns
|
| Receiver Number of Bits |
1
|
1
|
| Seated Height-Max |
4.572 mm
|
1.75 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Transmit Delay-Max |
35 ns
|
35 ns
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
2
|
3
|
| Manufacturer Package Code |
|
M8.15
|
| Factory Lead Time |
|
26 Weeks, 1 Day
|
| Date Of Intro |
|
2017-10-20
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| Technology |
|
BICMOS
|
|
|
|
Compare MAX3485ECPA+ with alternatives
Compare ISL83485IBZ with alternatives