MAX3355EEBC-T
vs
MAX3355EEBC+T
feature comparison
All Stats
Differences Only
Pbfree Code
No
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
BGA
BGA
Package Description
UCSP-12
UCSP-12
Pin Count
12
12
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Adjustable Threshold
NO
NO
Analog IC - Other Type
POWER SUPPLY SUPPORT CIRCUIT
POWER SUPPLY SUPPORT CIRCUIT
JESD-30 Code
R-PBGA-B12
R-PBGA-B12
JESD-609 Code
e0
e1
Length
2.12 mm
2.12 mm
Moisture Sensitivity Level
1
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
12
12
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA12,3X4,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.67 mm
0.65 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.6 V
2.6 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Width
1.54 mm
1.54 mm
Base Number Matches
2
2
Factory Lead Time
4 Weeks
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30