MAX334EJE
vs
ADG802BCB-REEL7
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
ANALOG DEVICES INC
Part Package Code
DIP
BGA
Package Description
DIP, DIP16,.3
WLCSP-6
Pin Count
16
6
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ALSO OPERATES WITH 5 TO 15 SINGLE SUPPLY
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-GDIP-T16
R-PBGA-B6
JESD-609 Code
e0
Moisture Sensitivity Level
1
Neg Supply Voltage-Max (Vsup)
-15 V
Neg Supply Voltage-Min (Vsup)
-5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Normal Position
NC
NC
Number of Channels
1
1
Number of Functions
4
1
Number of Terminals
16
6
Off-state Isolation-Nom
72 dB
61 dB
On-state Resistance Match-Nom
0.9 Ω
On-state Resistance-Max (Ron)
50 Ω
0.6 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
VFBGA
Package Equivalence Code
DIP16,.3
BGA6,2X3,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
0.67 mm
Supply Voltage-Max (Vsup)
15 V
5.5 V
Supply Voltage-Min (Vsup)
5 V
1.8 V
Supply Voltage-Nom (Vsup)
15 V
3 V
Surface Mount
NO
YES
Switch-off Time-Max
50 ns
15 ns
Switch-on Time-Max
100 ns
55 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
BALL
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Width
7.62 mm
1.14 mm
Base Number Matches
2
2
Length
2.18 mm
Compare MAX334EJE with alternatives
Compare ADG802BCB-REEL7 with alternatives