MAX33053EASA+T
vs
LU3XS38FT-BA388
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
AGERE SYSTEMS INC
Package Description
SOP,
BGA,
Reach Compliance Code
compliant
unknown
JESD-30 Code
R-PDSO-G8
S-PBGA-B388
JESD-609 Code
e3
Length
4.9 mm
35 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
388
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.75 mm
2.54 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
35 mm
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
388
HTS Code
8542.39.00.01
Qualification Status
Not Qualified
Technology
CMOS
Compare MAX33053EASA+T with alternatives
Compare LU3XS38FT-BA388 with alternatives