MAX3272AEGP
vs
SY88315BLMGTR
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICREL INC
|
Part Package Code |
QFN
|
DFN
|
Package Description |
4 X 4 MM, 0.90 MM HEIGHT, MO-220, QFN-20
|
HVQCCN, LCC16,.12SQ,20
|
Pin Count |
20
|
16
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Applications |
ATM; SDH; SONET
|
SDH; SONET
|
JESD-30 Code |
S-XQCC-N20
|
S-XQCC-N16
|
JESD-609 Code |
e0
|
e4
|
Length |
4 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC20,.16SQ,20
|
LCC16,.12SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
0.95 mm
|
Supply Current-Max |
0.044 mA
|
0.065 mA
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
|
Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
4 mm
|
3 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Manufacturer Package Code |
|
MLF
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MAX3272AEGP with alternatives
Compare SY88315BLMGTR with alternatives