MAX3272AEGP
vs
FX-500-LAF-GNK-D5-J6
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
|
Package Description |
4 X 4 MM, 0.90 MM HEIGHT, MO-220, QFN-20
|
SOJ,
|
Pin Count |
20
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Applications |
ATM; SDH; SONET
|
|
JESD-30 Code |
S-XQCC-N20
|
R-PDSO-J6
|
JESD-609 Code |
e0
|
e4
|
Length |
4 mm
|
13.97 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
6
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
SOJ
|
Package Equivalence Code |
LCC20,.16SQ,20
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
4.69 mm
|
Supply Current-Max |
0.044 mA
|
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
|
Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
NICKEL GOLD
|
Terminal Form |
NO LEAD
|
J BEND
|
Terminal Pitch |
0.5 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
4 mm
|
8.89 mm
|
Base Number Matches |
2
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX3272AEGP with alternatives
Compare FX-500-LAF-GNK-D5-J6 with alternatives