MAX313LETP-T
vs
MAX313LEUE+
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
QFN
TSSOP
Package Description
HVQCCN, LCC20,.20SQ,25
TSSOP, TSSOP16,.25
Pin Count
20
16
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
S-XQCC-N20
R-PDSO-G16
Length
5 mm
5 mm
Moisture Sensitivity Level
1
1
Neg Supply Voltage-Max (Vsup)
-20 V
-20 V
Neg Supply Voltage-Min (Vsup)
-4.5 V
-4.5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Normal Position
NO
NO
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
20
16
Off-state Isolation-Nom
75 dB
75 dB
On-state Resistance Match-Nom
0.3 Ω
0.3 Ω
On-state Resistance-Max (Ron)
10 Ω
10 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Equivalence Code
LCC20,.20SQ,25
TSSOP16,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.1 mm
Supply Voltage-Max (Vsup)
20 V
20 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
YES
Switch-off Time-Max
185 ns
185 ns
Switch-on Time-Max
225 ns
225 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
DUAL
Width
5 mm
4.4 mm
Base Number Matches
1
2
ECCN Code
EAR99
JESD-609 Code
e3
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare MAX313LETP-T with alternatives
Compare MAX313LEUE+ with alternatives