MAX308ESE
vs
HI3-0201HS-9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
ROCHESTER ELECTRONICS LLC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP16,.25
0.300 INCH, PLASTIC, DIP-16
Pin Count
16
16
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SINGLE-ENDED MULTIPLEXER
SPST
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
9.9 mm
19.175 mm
Moisture Sensitivity Level
1
1
Neg Supply Voltage-Max (Vsup)
-20 V
-20 V
Neg Supply Voltage-Min (Vsup)
-4.5 V
-4.5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
8
1
Number of Functions
1
4
Number of Terminals
16
16
Off-state Isolation-Nom
75 dB
72 dB
On-state Resistance Match-Nom
1.5 Ω
On-state Resistance-Max (Ron)
100 Ω
50 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.572 mm
Signal Current-Max
0.03 A
Supply Voltage-Max (Vsup)
20 V
20 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
NO
Switch-off Time-Max
150 ns
50 ns
Switch-on Time-Max
150 ns
50 ns
Switching
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
3.9 mm
7.62 mm
Base Number Matches
1
2
Compare MAX308ESE with alternatives
Compare HI3-0201HS-9 with alternatives