MAX306EPI+
vs
DG406EJ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
ROHS COMPLIANT, PLASTIC, DIP-28
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SINGLE-ENDED MULTIPLEXER
SINGLE-ENDED MULTIPLEXER
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
JESD-609 Code
e3
e0
Length
36.83 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Max (Vsup)
-20 V
Neg Supply Voltage-Min (Vsup)
-4.5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
16
16
Number of Functions
1
1
Number of Terminals
28
28
Off-state Isolation-Nom
69 dB
On-state Resistance Match-Nom
1.5 Ω
On-state Resistance-Max (Ron)
100 Ω
125 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Signal Current-Max
0.03 A
0.02 A
Supply Voltage-Max (Vsup)
20 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
150 ns
Switch-on Time-Max
200 ns
450 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
15.24 mm
Base Number Matches
2
2
Compare MAX306EPI+ with alternatives
Compare DG406EJ with alternatives