MAX3057ASA+
vs
TJA1057T/1Z
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
8-SOIC_N-150_MIL
|
|
| Package Description |
0.150 INCH, SOIC-8
|
,
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
8-SOIC_N-150_MIL
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2002-11-14
|
|
| Samacsys Manufacturer |
Analog Devices
|
NXP
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e3
|
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX3057ASA+ with alternatives
Compare TJA1057T/1Z with alternatives