MAX3051ESA+
vs
SN65HVD233SHKJ
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
SOP, SOP8,.25
|
DFP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
1000 Mbps
|
1000 Mbps
|
| JESD-30 Code |
R-PDSO-G8
|
R-CDFP-F8
|
| JESD-609 Code |
e3
|
|
| Length |
4.9 mm
|
7.035 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
85 °C
|
210 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP8,.25
|
FL8(UNSPEC)
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.21 mm
|
| Supply Current-Max |
0.07 mA
|
0.006 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
5.75 mm
|
| Base Number Matches |
2
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Number of Channels |
|
1
|
|
|
|
Compare MAX3051ESA+ with alternatives
Compare SN65HVD233SHKJ with alternatives