MAX3050ASA+T
vs
TLE9250XLEXUMA1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
INFINEON TECHNOLOGIES AG
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.150 INCH, SOIC-8
|
HTSON,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
2000 Mbps
|
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-N8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
2A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HTSON
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Current-Max |
0.072 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
MATTE TIN
|
Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
20 Weeks
|
| Samacsys Manufacturer |
|
Infineon
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare MAX3050ASA+T with alternatives
Compare TLE9250XLEXUMA1 with alternatives