MAX2829ETN
vs
MAX2829ETN-TD
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFN
|
|
Package Description |
8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5 , TQFN-56
|
8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56
|
Pin Count |
56
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
JESD-30 Code |
S-XQCC-N56
|
S-XQCC-N56
|
Length |
8 mm
|
8 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Nom |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Telecom IC Type |
SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
8
|
2
|
|
|
|
Compare MAX2829ETN with alternatives
Compare MAX2829ETN-TD with alternatives