MAX24310EXG+
vs
ZL30410QCG1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
ZARLINK SEMICONDUCTOR INC
Part Package Code
BGA
Package Description
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80
Pin Count
81
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B81
S-PQFP-G80
Length
10 mm
14 mm
Number of Functions
1
1
Number of Terminals
81
80
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.47 mm
1.6 mm
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
14 mm
Base Number Matches
2
2
Applications
SDH; SONET
JESD-609 Code
e3
Moisture Sensitivity Level
3
Package Equivalence Code
QFP80,.64SQ
Qualification Status
Not Qualified
Supply Current-Max
0.155 mA
Terminal Finish
MATTE TIN
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