MAX2335ETI+
vs
MAX2335ETI+T
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN,
|
5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-22OWHHD-1, TQFN-28
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
JESD-30 Code |
S-XQCC-N28
|
S-XQCC-N28
|
JESD-609 Code |
e3
|
e3
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
4
|
2
|
|
|
|
Compare MAX2335ETI+ with alternatives
Compare MAX2335ETI+T with alternatives