MAX2306EGI-T
vs
MAX2310EEI-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
QFN
SSOP
Package Description
5 X 5 MM, 0.90 MM HEIGHT, QFN-28
SSOP, SSOP28,.25
Pin Count
28
28
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XQCC-N28
R-PDSO-G28
JESD-609 Code
e0
e0
Length
5 mm
9.89 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
28
28
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
SSOP
Package Equivalence Code
LCC28,.2SQ,20
SSOP28,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.9 mm
1.73 mm
Supply Current-Max
0.0415 mA
0.0415 mA
Supply Voltage-Nom
2.75 V
2.75 V
Surface Mount
YES
YES
Telecom IC Type
BASEBAND CIRCUIT
BASEBAND CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
TIN LEAD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.635 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
5 mm
3.9 mm
Base Number Matches
1
1
Compare MAX2306EGI-T with alternatives
Compare MAX2310EEI-T with alternatives