MAX2112ETI+
vs
SAB3035N
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
DIP
|
| Package Description |
5 X 5 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WHHD-1, TQFN-28
|
DIP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in IF Amplifier |
YES
|
NO
|
| Consumer IC Type |
VIDEO TUNER
|
VIDEO TUNER
|
| Input Frequency-Max (RF) |
2175 MHz
|
|
| Input Frequency-Min (RF) |
925 MHz
|
14.5 MHz
|
| JESD-30 Code |
S-XQCC-N28
|
R-PDIP-T28
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Noise Figure-Nom |
9 dB
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
DIP
|
| Package Equivalence Code |
LCC28,.2SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
5.1 mm
|
| Supply Current-Max |
160 mA
|
50 mA
|
| Supply Voltage-Max (Vsup) |
3.47 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
3.13 V
|
4.7 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5 mm
|
15.24 mm
|
| Base Number Matches |
3
|
1
|
| Number of Bands |
|
4
|
|
|
|
Compare MAX2112ETI+ with alternatives
Compare SAB3035N with alternatives