MAX191BC/D
vs
MAX191AMRG
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
DIE
|
DIP
|
Package Description |
DIE-24
|
CERDIP-24
|
Pin Count |
24
|
24
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
5.25 V
|
5.25 V
|
Analog Input Voltage-Min |
-5.25 V
|
-5.25 V
|
Conversion Time-Max |
18 µs
|
18 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
R-XUUC-N24
|
R-GDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Linearity Error-Max (EL) |
0.0244%
|
0.0244%
|
Moisture Sensitivity Level |
1
|
1
|
Negative Supply Voltage-Nom |
-5 V
|
-5 V
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
SERIAL, PARALLEL, 8 BITS
|
SERIAL, PARALLEL, 8 BITS
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIE
|
DIP
|
Package Equivalence Code |
DIE OR CHIP
|
DIP24,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
0.1 MHz
|
0.1 MHz
|
Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
1
|
2
|
Peak Reflow Temperature (Cel) |
|
245
|
Seated Height-Max |
|
5.72 mm
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
15.24 mm
|
|
|
|
Compare MAX191BC/D with alternatives
Compare MAX191AMRG with alternatives