MAX17044X+T10
vs
MAX17044X+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
| Part Package Code |
BGA
|
9-WLCSP-N/A
|
| Package Description |
VFBGA, BGA9,3X3,16
|
|
| Pin Count |
9
|
9
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
R-PBGA-B9
|
R-PBGA-B9
|
| JESD-609 Code |
e2
|
|
| Length |
1.595 mm
|
1.595 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA9,3X3,16
|
BGA9,3X3,16
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.69 mm
|
0.69 mm
|
| Supply Voltage-Max (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER NICKEL
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.415 mm
|
1.415 mm
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
9-WLCSP-N/A
|
| Date Of Intro |
|
2010-05-24
|
| Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX17044X+T10 with alternatives
Compare MAX17044X+ with alternatives