MAX16126TCA+
vs
MAX15090BEWI+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC12,.12SQ,20
|
VFBGA,
|
| Pin Count |
12
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
Hot Swap Controller
|
| JESD-30 Code |
S-XQCC-N12
|
R-XBGA-B28
|
| JESD-609 Code |
e3
|
e2
|
| Length |
3 mm
|
3.525 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
28
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC12,.12SQ,20
|
BGA28,4X7,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.69 mm
|
| Supply Voltage-Max (Vsup) |
30 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER NICKEL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Threshold Voltage-Nom |
+1.225V
|
1.23
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
2.065 mm
|
| Base Number Matches |
2
|
2
|
| Supply Current-Max (Isup) |
|
6.2 mA
|
|
|
|
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