MAX16033PLB31+T
vs
MAX16033PLB29+T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
| Part Package Code |
DFN
|
10-LFCSP-2X2X0.75
|
| Package Description |
2 X 2 MM, LEAD FREE, MICRO, DFN-10
|
|
| Pin Count |
10
|
10
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
BATTERY BACKUP SUPERVISOR
|
BATTERY BACKUP SUPERVISOR
|
| JESD-30 Code |
S-XDSO-N10
|
S-XDSO-N10
|
| JESD-609 Code |
e4
|
e4
|
| Length |
2 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
VSON
|
VSON
|
| Package Equivalence Code |
SOLCC10,.08,16
|
SOLCC10,.08,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max (Isup) |
0.05 mA
|
0.05 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
GOLD NICKEL
|
Gold/Nickel (Au/Ni)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
10-LFCSP-2X2X0.75
|
| Date Of Intro |
|
2007-08-22
|
| Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX16033PLB31+T with alternatives
Compare MAX16033PLB29+T with alternatives