MAX15090AEWI+
vs
MAX15090AEWI+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Part Package Code |
28-WLCSP-N/A
|
28-WLCSP-N/A
|
| Pin Count |
28
|
28
|
| Manufacturer Package Code |
28-WLCSP-N/A
|
28-WLCSP-N/A
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Date Of Intro |
2012-10-08
|
2012-10-08
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
ANALOG CIRCUIT
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
1
|
| JESD-30 Code |
|
R-PBGA-B28
|
| Length |
|
3.525 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
28
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
VFBGA
|
| Package Equivalence Code |
|
BGA28,4X7,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Seated Height-Max |
|
0.69 mm
|
| Supply Current-Max (Isup) |
|
0.75 mA
|
| Supply Voltage-Max (Vsup) |
|
18 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BICMOS
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
2.065 mm
|
|
|
|