MAX14748EWW+
vs
MAX14748EWW+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
Package Description |
VFBGA,
|
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
R-PBGA-B54
|
R-PBGA-B54
|
JESD-609 Code |
e2
|
|
Length |
3.968 mm
|
3.968 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
54
|
54
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.69 mm
|
0.69 mm
|
Supply Voltage-Nom (Vsup) |
8.3 V
|
8.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER NICKEL
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2.768 mm
|
2.768 mm
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
54-WLCSP-N/A
|
Pin Count |
|
54
|
Manufacturer Package Code |
|
54-WLCSP-N/A
|
Date Of Intro |
|
2017-10-26
|
Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX14748EWW+ with alternatives
Compare MAX14748EWW+ with alternatives