MAX13342EETD+T
vs
MAX13342EEBC+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
14-LFCSP-3X3X0.75
|
BGA
|
| Pin Count |
14
|
12
|
| Manufacturer Package Code |
14-LFCSP-3X3X0.75
|
|
| Date Of Intro |
2006-11-10
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| JESD-30 Code |
S-PDSO-N14
|
R-PBGA-B12
|
| JESD-609 Code |
e3
|
e1
|
| Length |
3 mm
|
2.12 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
12
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
VFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.67 mm
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
1.54 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
|
VFBGA,
|
| Reach Compliance Code |
|
compliant
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX13342EETD+T with alternatives
Compare MAX13342EEBC+ with alternatives