MAX130EPL+
vs
TC7106AIPL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TELCOM SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-40
|
DIP, DIP40,.6
|
| Pin Count |
40
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Analog Input Voltage-Max |
2 V
|
2 V
|
| Analog Input Voltage-Min |
0.2 V
|
0.2 V
|
| Converter Type |
ADC, DUAL-SLOPE
|
ADC, DUAL-SLOPE
|
| JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
| JESD-609 Code |
e3
|
e0
|
| Length |
52.075 mm
|
|
| Linearity Error-Max (EL) |
0.0015%
|
0.0122%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
16
|
13
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, WORD
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP40,.6
|
DIP40,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
0.4 mA
|
1.8 mA
|
| Supply Voltage-Nom |
9 V
|
9 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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