MAX13050ASA+
vs
MCP2558FDT-H/MF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
Package Description
0.150 INCH, ROHS COMPLIANT, MS-012AA, SOIC-8
HVSON,
Pin Count
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Data Rate
1000 Mbps
8000 Mbps
JESD-30 Code
R-PDSO-G8
S-PDSO-N8
JESD-609 Code
e3
e3
Length
4.9 mm
3 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Transceivers
1
1
Operating Temperature-Max
125 °C
150 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVSON
Package Equivalence Code
SOP8,.25
SOLCC8,.12,25
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.75 mm
1 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
Telecom IC Type
INTERFACE CIRCUIT
CAN FD TRANSCEIVER
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
3 mm
Base Number Matches
2
1
Factory Lead Time
6 Weeks
Date Of Intro
2016-03-30
Samacsys Manufacturer
Microchip
Screening Level
TS 16949
Supply Current-Max
70 mA
Compare MAX13050ASA+ with alternatives
Compare MCP2558FDT-H/MF with alternatives