MAX12555ETL+
vs
MAX12554ETL/GG8
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFN
|
|
Package Description |
HVQCCN, LCC40,.24SQ,20
|
,
|
Pin Count |
40
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.C.3
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
1.024 V
|
|
Analog Input Voltage-Min |
-1.024 V
|
|
Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
JESD-30 Code |
S-XQCC-N40
|
|
JESD-609 Code |
e3
|
|
Length |
6 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Analog In Channels |
1
|
|
Number of Bits |
14
|
|
Number of Functions |
1
|
|
Number of Terminals |
40
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Bit Code |
2'S COMPLEMENT BINARY
|
OFFSET BINARY
|
Output Format |
PARALLEL, WORD
|
|
Package Body Material |
UNSPECIFIED
|
|
Package Code |
HVQCCN
|
|
Package Equivalence Code |
LCC40,.24SQ,20
|
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Sample Rate |
95 MHz
|
|
Sample and Hold / Track and Hold |
TRACK
|
|
Seated Height-Max |
0.8 mm
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
6 mm
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare MAX12555ETL+ with alternatives
Compare MAX12554ETL/GG8 with alternatives