MASMBJP6KE110E3
vs
P5KE10C-TP-HF
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Package Description |
R-PDSO-C2
|
O-PALF-W2
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Breakdown Voltage-Max |
121 V
|
14.1 V
|
| Breakdown Voltage-Min |
99 V
|
11.1 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-214AA
|
DO-15
|
| JESD-30 Code |
R-PDSO-C2
|
O-PALF-W2
|
| Non-rep Peak Rev Power Dis-Max |
600 W
|
500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
1.38 W
|
1 W
|
| Rep Pk Reverse Voltage-Max |
89.2 V
|
10 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Form |
C BEND
|
WIRE
|
| Terminal Position |
DUAL
|
AXIAL
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
EXCELLENT CLAMPING CAPABILITY
|
| Case Connection |
|
ISOLATED
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Reference Standard |
|
UL RECOGNIZED
|
| Time@Peak Reflow Temperature-Max (s) |
|
5
|
|
|
|
Compare MASMBJP6KE110E3 with alternatives
Compare P5KE10C-TP-HF with alternatives