MAQ9264C95CD
vs
U632H64D1K45
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
DYNEX SEMICONDUCTOR LTD
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Package Description
,
DIP, DIP28,.6
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
3
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
28
Access Time-Max
45 ns
JESD-30 Code
R-PDIP-T28
JESD-609 Code
e0
Length
37.1 mm
Memory Density
65536 bit
Memory IC Type
NON-VOLATILE SRAM
Memory Width
8
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
1
Number of Terminals
28
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.1 mm
Standby Current-Max
0.003 A
Supply Current-Max
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Compare MAQ9264C95CD with alternatives
Compare U632H64D1K45 with alternatives