MAQ2901CL
vs
5962-8853503QA
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
SRI INTERNATIONAL
|
Package Description |
,
|
DIP, DIP40,.6
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Clock Frequency-Max |
25 MHz
|
|
External Data Bus Width |
4
|
4
|
JESD-30 Code |
R-CDIP-T40
|
R-GDIP-T40
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Qualified
|
Supply Current-Max |
10 mA
|
90 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
BIT-SLICE MICROPROCESSOR
|
BIT-SLICE MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
40
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
DIP40,.6
|
Screening Level |
|
MIL-STD-883
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare MAQ2901CL with alternatives
Compare 5962-8853503QA with alternatives