MAQ17502CL vs L29C101DMB45 feature comparison

MAQ17502CL Dynex Semiconductor

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L29C101DMB45 LOGIC Devices Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS LOGIC DEVICES INC
Package Description , DIP, DIP64,.9
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
External Data Bus Width 16 16
JESD-30 Code R-CDIP-T64 R-CDIP-T64
Number of Terminals 64 64
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 35 mA 30 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE MICROPROCESSOR
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Pin Count 64
Additional Feature 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ
Clock Frequency-Max 25 MHz
JESD-609 Code e0
Length 81.28 mm
Moisture Sensitivity Level 3
Package Code DIP
Package Equivalence Code DIP64,.9
Peak Reflow Temperature (Cel) 225
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 3.81 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 22.86 mm

Compare MAQ17502CL with alternatives

Compare L29C101DMB45 with alternatives