MAPLAD7.5KP33CA
vs
MAPLAD7.5KP33CAE3
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Terminal Finish |
TIN LEAD
|
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
40 Weeks
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Breakdown Voltage-Max |
|
40.6 V
|
| Breakdown Voltage-Min |
|
36.7 V
|
| Breakdown Voltage-Nom |
|
38.65 V
|
| Case Connection |
|
CATHODE
|
| Clamping Voltage-Max |
|
53.3 V
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
|
S-PSSO-G1
|
| Non-rep Peak Rev Power Dis-Max |
|
7500 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
1
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Polarity |
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
|
2.5 W
|
| Reference Standard |
|
AEC-Q101; IEC-61000-4-2, 4-4, 4-5; MIL-19500
|
| Rep Pk Reverse Voltage-Max |
|
33 V
|
| Reverse Current-Max |
|
10 µA
|
| Reverse Test Voltage |
|
33 V
|
| Surface Mount |
|
YES
|
| Technology |
|
AVALANCHE
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|