MACHLV210-12JC
vs
EPM5130QC-2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
ALTERA CORP
|
Part Package Code |
LCC
|
QFP
|
Package Description |
PLASTIC, LCC-44
|
QFP, QFP100,.7X.9
|
Pin Count |
44
|
100
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
NO
|
LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
|
Clock Frequency-Max |
55.6 MHz
|
40 MHz
|
In-System Programmable |
NO
|
NO
|
JESD-30 Code |
S-PQCC-J44
|
S-PQFP-G100
|
JESD-609 Code |
e0
|
e0
|
JTAG BST |
NO
|
NO
|
Length |
16.5862 mm
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
4
|
19
|
Number of I/O Lines |
32
|
64
|
Number of Macro Cells |
64
|
128
|
Number of Terminals |
44
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
4 DEDICATED INPUTS, 32 I/O
|
19 DEDICATED INPUTS, 64 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QFP
|
Package Equivalence Code |
LDCC44,.7SQ
|
QFP100,.7X.9
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
225
|
220
|
Programmable Logic Type |
EE PLD
|
OT PLD
|
Propagation Delay |
12 ns
|
45 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.572 mm
|
|
Supply Voltage-Max |
3.6 V
|
5.25 V
|
Supply Voltage-Min |
3 V
|
4.75 V
|
Supply Voltage-Nom |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
16.5862 mm
|
|
Base Number Matches |
4
|
1
|
|
|
|
Compare MACHLV210-12JC with alternatives
Compare EPM5130QC-2 with alternatives